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Direct preparation of 1.35-eV-bandgap CuO:S film by chemical bath deposition

机译:化学浴沉积直接制备1.35-eV带隙CuO:S薄膜

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摘要

500-nm -thick-CuO:S film has been prepared on a glass substrate by a chemical bath deposition in an aqueous solution containing copper(II) nitrate, ammonium nitrate, and ammonia water at 323-343 K. The CuO:S films possessed a monoclinic lattice and bandgap energy of 1.35 eV, which were characteristic of semiconductor CuO. The deposition mechanism was briefly discussed from the potential- p H diagram thermodynamically calculated for the copper-ammonia-water system.
机译:通过在323-343 K的硝酸铜(II),硝酸铵和氨水的水溶液中化学浴沉积,在玻璃基板上制备了500 nm厚的CuO:S膜。CuO:S膜具有1.35 eV的单斜晶格和带隙能,这是半导体CuO的特征。从热力学计算铜-氨-水系统的电势-P H图简要讨论了沉积机理。

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