Measurement of CMP Slurry Abrasive Size Distribution by Scanning Mobility Particle Sizer

摘要

This article introduces an abrasive particle size measurement by a scanning mobility particle sizer (SMPS) to measure precise size distribution in the nanoregime. Static light scattering (SLS), which is a conventional method, is compared with the SMPS-based technique. Both measurement techniques differ in the measurement of SiO2 and CeO2 abrasive particle sizes. Results showed that SMPS is more sensitive than the SLS equipment due to a single-particle count, which is suitable for representing nanoparticle abrasives. To the best of our knowledge, there has been no article yet about the use of an SMPS for the measurement of abrasive size in chemical mechanical planarization (CMP) technology.