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首页> 外文期刊>Electrochemical and solid-state letters >Low Voltage Switching Characteristics of 60 nm Thick SrBi_2Ta_2O_9 Thin Films Deposited by Plasma-Enhanced ALD
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Low Voltage Switching Characteristics of 60 nm Thick SrBi_2Ta_2O_9 Thin Films Deposited by Plasma-Enhanced ALD

机译:等离子体增强ALD沉积60 nm厚SrBi_2Ta_2O_9薄膜的低压开关特性

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60 nm thick SrBi_2Ta_2O_9 (SBT) thin films were fabricated using plasma-enhanced atomic layer deposition (ALD) with an alternating supply of single cocktail source and oxygen plasma. The linear relationship between the number of cycles and film thickness and a constant deposition rate with source pulse time suggests that a self-limiting process that has distinct characteristics of ALD was achieved. The 60 nm thick SrBi_2Ta_2O_9 films that were annealed at 750 deg C completely crystallized to the layer-structured perovskite phase. The SBT capacitors showed excellent ferroelectric switching properties. Low voltage switching below 1.5 V was achieved successfully in the 60 nm SBT capacitor.
机译:使用等离子体增强的原子层沉积(ALD)和交替供应的单一鸡尾酒源和氧等离子体制造了60 nm厚的SrBi_2Ta_2O_9(SBT)薄膜。循环次数与膜厚度之间的线性关系以及恒定的沉积速率与源脉冲时间之间的线性关系表明,实现了具有独特的ALD特性的自限过程。在750℃退火的60 nm厚SrBi_2Ta_2O_9薄膜完全结晶成层状钙钛矿相。 SBT电容器表现出出色的铁电开关性能。在60 nm SBT电容器中成功实现了低于1.5 V的低压切换。

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