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首页> 外文期刊>International journal of flexible manufacturing systems: Design, Analysis and Operation of Manufacturing and Assembly Systems >Assembly root cause analysis: a way to reduce dimensional variation in assembled products
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Assembly root cause analysis: a way to reduce dimensional variation in assembled products

机译:装配根本原因分析:一种减少装配产品尺寸变化的方法

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The objective of root cause analysis (RCA) is to make the trouble shooting dimensional error efforts in an assembly plant more efficient and successful by pinpointing the underlying reasons for variation. The result of eliminating or limiting these sources of variation is a real and long term process improvement. Complex products are manufactured in multileveled hierarchical assembly processes using positioning fixtures. A general approach for diagnosing fixture related errors using routine measurement on products, rather than from special measurements on fixtures, is presented. The assembly variation is effectively tracked down into variation in the fixture tooling elements, referred to as locators. In this way, the process engineers can focus on adjusting the locators affected by most variation. However, depending on the assembly process configuration, inspection strategy, and the type of locator error, it can be impossible to completely sort out the variation caused by an individual locator. The reason for this is that faults in different locators can cause identical dimensional deviation in the inspection station. Conditions guaranteeing diagnosability are derived by considering multiple uncoupled locator faults, in contrast to previous research focusing on single or multiple coupled locator faults. Furthermore, even if an assembly is not diagnosable, it is still possible to gain information for diagnosis by using a novel approach to find an interval for each locator containing the true underlying locator variation. In this way, some locators can be excluded from further analysis, some can be picked out for adjustment, and others remain as potential reason for assembly variation. Another way around the problem of diagnosability is to make a higher level diagnosis by calculating the amount of variation originating from different assembly stations. Also, a design for diagnosis approach is discussed, where assembly and inspection concepts allowing for root cause analysis are the objective.
机译:根本原因分析 (RCA) 的目标是通过查明变化的根本原因,使装配厂的尺寸误差排除工作更加高效和成功。消除或限制这些变异源的结果是真正和长期的流程改进。使用定位夹具在多级分层装配工艺中制造复杂产品。提出了一种使用产品常规测量而不是夹具特殊测量来诊断夹具相关错误的一般方法。装配变化被有效地跟踪为夹具工具元件(称为定位器)的变化。通过这种方式,工艺工程师可以专注于调整受大多数变化影响的定位器。但是,根据装配过程配置、检查策略和定位器误差的类型,可能无法完全理清单个定位器引起的变化。其原因是不同定位器的故障会导致检查站出现相同的尺寸偏差。通过考虑多个非耦合定位器故障,可以得出保证可诊断性的条件,这与之前专注于单个或多个耦合定位器故障的研究形成鲜明对比。此外,即使组件不可诊断,仍然可以通过使用一种新方法来为包含真实基础定位器变体的每个定位器查找间隔来获得诊断信息。这样,一些定位器可以从进一步的分析中排除,一些定位器可以被挑选出来进行调整,而另一些定位器仍然是装配变化的潜在原因。解决可诊断性问题的另一种方法是通过计算来自不同装配站的变异量来进行更高级别的诊断。此外,还讨论了诊断方法的设计,其中允许根本原因分析的装配和检查概念是目标。

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