IBIS and SPICE simulation of microprocessor chipsets and memory systems are necessary to ensure that the signal propagates through the computer motherboard with minimal distortion, without causing erroneous switching patterns and signal degradation-ensuring the signal integrity of the motherboard design. The accuracy of such simulation depends completely upon the accuracy of the models for the interconnect components of the digital design, such as board traces, connectors and packages. The accuracy of these models can be ensured with the use of TDR instrumentation, a very easy-to-use and intuitive technology for obtaining accurate models for the digital system components.
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