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机译:TA15合金在带板栅的四层中空结构中的超塑性成形/扩散结合及力学性能
Nanyang Normal Univ, Sch Mech & Elect Engn, Nanyang 473061, Peoples R China;
Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China;
SPF; DB; Four; 8208; layer hollow structure; TA15 alloy; FEM; Mechanical property;
机译:The superplastic forming/diffusion bonding of TA7 titanium alloy for manufacturing hollow structure with stiffeners
机译:Mechanical and Microstructural Characterization of the Bond Interface Formed in Diffusion Welding of CoCrNi Medium Entropy Alloy (MEA) and AISI 304 Stainless Steel Under Various Processing Parameters
机译:Preparation and mechanical properties of a composite by glass-forming alloy bonding aluminum oxide
机译:First-fevel Interconnects in Electronics Packaging: Alloyed Silver Intermetallic Growth Kinetics and Their Mechanical Reliability Effects on Wire Bonding =电子封装中的第一级互连:合金银互联金属生长动力学 和他们的机械可靠性 对线束的影响