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The application of molecular dynamics to the study of plasma-surface interactions: CFx with silicon

机译:分子动力学在等离子-表面相互作用研究中的应用:CFx与硅

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In this paper, we provide an overview of the use of molecular dynamics for simulations involving energetic particles (Ar, F, and CFx) interacting with silicon surfaces. The groups (including our own) that have performed this work are seeking to advance the fundamental understanding of plasma interactions at surfaces. Although this paper restricts itself largely to the systems bracketed above, the approach and general mechanisms involved are applicable to a much wider range of systems. Proper description of plasma-related systems generally requires a large number of atoms in order to correctly characterize the interactions. Consequently, the bulk of the present work, and the main focus of the text, is based on classical molecular dynamics. In MD simulations, one of the most critical considerations is the selection of the interatomic potential. For simulations involving silicon etching, the choice is typically made between the Stillinger-Weber and the Tersoff-Brenner potentials. An outline of the two potentials is given, including efforts that have been made to improve and optimize the potentials and their parameters. Subsequently, we focus on some of the practical details involved in establishing the simulation process and outline how various parameters (e.g. heat bath, relaxation time and cell size) influence the simulation results. These sections deal with the influences of the heat bath (application time, rising time), the time-step and total integration time of molecular trajectories, the relaxation of the sample (during and post-etching) and the sample size. The approach is essentially pedagogical in nature, and may be of interest to those less familiar with the techniques. To illustrate the type of results that can be produced we present a case study for 100 eV CF3+ interacting with a Si(100)-2x1 surface at different sample temperatures (100-800 K). The simulations reveal details of the change in etch rate, the F-turnover and the standing coverage of functional groups as a function of the temperature. Our primary interest is in studies with relevance for plasma-surface interactions. We discuss the general mechanisms that are most important in plasma-surface interactions and give an overview of some of the wide range of results that have been produced for various systems. The results presented illustrate that careful consideration must be given to the precise configuration of the plasma system. Numerous factors, including the chemical species, the energy and chemical mix of the incident particles and the surface composition and structure can play a crucial role in determining the net outcome of the interaction.
机译:在本文中,我们概述了分子动力学在涉及高能粒子(Ar,F和CFx)与硅表面相互作用的模拟中的应用。完成这项工作的小组(包括我们自己的小组)正在寻求增进对表面等离子体相互作用的基本理解。尽管本文将自己主要限于上面列出的系统,但是所涉及的方法和一般机制适用于范围更广的系统。正确描述与等离子体相关的系统通常需要大量原子,才能正确表征相互作用。因此,本研究的大部分内容以及本文的主要重点都基于经典分子动力学。在MD模拟中,最关键的考虑因素之一是原子间电势的选择。对于涉及硅蚀刻的模拟,通常在Stillinger-Weber电位和Tersoff-Brenner电位之间进行选择。概述了这两种潜力,包括为改善和优化潜力及其参数所做的努力。随后,我们将重点关注建立模拟过程所涉及的一些实用细节,并概述各种参数(例如热浴,松弛时间和像元大小)如何影响模拟结果。这些部分涉及热浴的影响(施加时间,上升时间),分子轨迹的时间步长和总积分时间,样品的弛豫(在蚀刻过程中和蚀刻后)以及样品大小的影响。该方法本质上是教学法,对于那些不太熟悉该技术的人可能很感兴趣。为了说明可以产生的结果类型,我们提供了一个案例研究,该案例研究了100 eV CF3 +在不同样品温度(100-800 K)下与Si(100)-2x1表面相互作用的情况。仿真揭示了蚀刻速率,F转换率和官能团的固定覆盖范围随温度变化的详细信息。我们的主要兴趣是与等离子体-表面相互作用相关的研究。我们讨论了在等离子体-表面相互作用中最重要的一般机制,并概述了为各种系统产生的一系列广泛结果。给出的结果表明,必须仔细考虑等离子体系统的精确配置。许多因素,包括化学种类,入射粒子的能量和化学混合以及表面组成和结构,在决定相互作用的最终结果方面都起着至关重要的作用。

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