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首页> 外文期刊>Electrical Design News: The Magazine of the Electronics Industry >POWER MOSFETs CONTINUE TO EVOLVE, THANKS TO WAFER THINNING AND INNOVATIVE PACKAGING
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POWER MOSFETs CONTINUE TO EVOLVE, THANKS TO WAFER THINNING AND INNOVATIVE PACKAGING

机译:功率MOSFET不断发展,得益于晶圆减薄和创新封装

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摘要

New switching power transistors using wide-bandgap semiconductors, such as SiC (silicon carbide) and GaN (gallium nitride) on silicon, will likely continue to significantly increase power-conversion efficiency (Reference 1). However, good ol' silicon power MOSFETs currently dominate the market and will continue to do so for several more years, APEC (Applied Power Electronics Conference), which this year takes place on Feb 5 through Feb 9 in Orlando, FL, is traditionally the biggest showcase for power-switching devices and a good venue for checking in on power-MOSFET technology.
机译:使用宽带隙半导体(如硅上的SiC(碳化硅)和GaN(氮化镓))的新型开关功率晶体管可能会继续显著提高功率转换效率(参考文献1)。然而,优秀的硅功率MOSFET目前在市场上占据主导地位,并将在未来几年内继续保持这种状态,今年2月5日至2月9日在佛罗里达州奥兰多举行的APEC(应用电力电子会议)传统上是功率开关器件的最大展示,也是检查功率MOSFET技术的良好场所。

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