...
机译:功率MOSFET不断发展,得益于晶圆减薄和创新封装
机译:An innovative approach to wafer-level MEMS packaging
机译:An innovative approach to wafer-level MEMS packaging
机译:Visible Light-Emitting Diodes With Thin-Film-Flip-Chip-Based Wafer-Level Chip-Scale Package Technology Using Anisotropic Conductive Film Bonding
机译:Photonic neuromorphic thin-film transistors with ultra-low power dissipation
机译:Thermos3,用于smart power mosfets的3D电热仿真工具
机译:佛罗里达电力协调组:nan Evolving power pool