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Hydrogen-bonding assemblies constructed from metalloligand building blocks and H2O

机译:由金属配体和H2O构成的氢键结合组件

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New hydrogen-bonding assemblies were synthesized from the reaction of a metalloligand, [Cu(2,4-pydca)(2)](2-) (L-Cu) (2,4-pydca = 2,4-pyridinedicarboxylate), with a Fe-II ion or an imidazole in an aqueous medium and crystallographically characterized. The obtained compounds, [Fe(H2O)(6)][Cu(2,4-pydca)(2)] (1) and [Cu(2,4-pydca)(imidazole)(2)] (.) 2H(2)O (2), have metalloligand dimer units, [Cu-2(2,4-pydca)(4)](4-) and [Cu-2(2,4-pydca)(2)(imidazole)(4)], respectively, each of which assembles by pi-pi (1) and hydrogen-bonding (2) interactions to form 1-D metalloligand arrays. The I-D metalloligand arrays are linked by rich hydrogen-bonding interactions via H2O molecules. (C) 2004 Elsevier B.V. All rights reserved.
机译:由金属配体[Cu(2,4-pydca)(2)](2-)(L-Cu)(2,4-pydca = 2,4-吡啶二甲酸)反应合成了新的氢键组装体,用Fe-II离子或咪唑在水性介质中结晶并表征。获得的化合物[Fe(H2O)(6)] [Cu(2,4-pydca)(2)](1)和[Cu(2,4-pydca)(咪唑)(2)](。)2H (2)O(2),具有金属配体二聚体单元,[Cu-2(2,4-pydca)(4)](4-)和[Cu-2(2,4-pydca)(2)(咪唑) (4)],分别通过pi-pi(1)和氢键(2)相互作用组装,形成一维金属配体阵列。 I-D金属配体阵列通过H2O分子通过丰富的氢键相互作用连接。 (C)2004 Elsevier B.V.保留所有权利。

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