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首页> 外文期刊>Inorganica Chimica Acta >POLYMERIC 1,7-DITHENYLIDENE-1,4,7-TRIAZAHEPTANE COPPER(II) CHLORIDE WITH EXTENDED LINEAR STRUCTURE
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POLYMERIC 1,7-DITHENYLIDENE-1,4,7-TRIAZAHEPTANE COPPER(II) CHLORIDE WITH EXTENDED LINEAR STRUCTURE

机译:扩展线性结构的1,7-二甲苯-1,4,7-三氮杂庚烷铜(II)聚合物

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摘要

The crystal and molecular structures of [Cu-3(dienSS)(2)Cl-6] where dienSS is a Schiff base 1,7-dithenylidene-1,4,7-triazaheptane are reported. The compound is polymeric with extended linear structure; it has a trimeric repeating unit in which two edge-sharing pseudooctahedral groups [Cu(dienSS)Cl-3](-) are linked by single Cl bridges to a highly distorted tetrahedral [CuCl4](2-) group. The space group is Pbcn, Z = 4 with a = 13.979(2), b = 20.567(2), c = 12.9481(9) Angstrom , DienSS, a potentially pentadentate ligand coordinates to Cu-II as tridentate with dangling thiophene residues; it is located normal to the Cu-Cu axis with CuN = 2.026(7), 2.021 (7) and 2.024(7) A. The three CuCl bonds completing Cu(dienSS) to a pseudooctahedron differ in length and position: CuCl = 2.253(2) Angstrom is in the same plane as the three CuN; CuCl = 3.029(2) Angstrom is perpendicular to that plane and takes part in the double bridge Cu(Cl)(2)CU; CuCl = 3.133 Angstrom takes part in a single bridge with the [CuCl4](2-) group. The [CuCl4](2-) group is closer to a planar structure than to a tetrahedron: trans-ClCuCl angles are 154.0(2) and 157.2(2)degrees. The CuCl bonds are 2.286(2) Angstrom (bridging to two different six-coordinate Cu units) and 2.226(3) Angstrom (free). Both the elongated pseudooctahedra and the planar structure are due to vibronic coupling. Molecular mechanics (MM), Austin Model 1 (AM1) and extended Huckel (EH) calculations suggest that electron delocalization to the thiophene groups occurs upon coordination. [References: 50]
机译:报道了[Cu-3(dienSS)(2)Cl-6]的晶体和分子结构,其中dienSS是席夫碱的1,7-二噻吩基-1,4,7-三氮杂庚烷。该化合物是具有延长的线性结构的聚合物。它具有三聚体重复单元,其中两个边缘共享的伪八面体基团[Cu(dienSS)Cl-3](-)通过单个Cl桥连接到高度扭曲的四面体[CuCl4](2-)基团。空间群是Pbcn,Z = 4,a = 13.979(2),b = 20.567(2),c = 12.9481(9)埃,DienSS,一个潜在的五齿配位体配位为Cu-II,为三齿且带有悬空的噻吩残基;它位于垂直于Cu-Cu轴的位置,其中CuN = 2.026(7),2.021(7)和2.024(7)A。三个完成Cu(dienSS)到伪八面体的CuCl键的长度和位置不同:CuCl = 2.253 (2)埃与三个CuN在同一平面上; CuCl = 3.029(2)埃垂直于该平面,并参与双桥Cu(Cl)(2)CU; CuCl = 3.133埃与[CuCl4](2-)基团参与一个单桥。 [CuCl4](2-)基团比四面体更接近平面结构:反式-ClCuCl角为154.0(2)和157.2(2)度。 CuCl键为2.286(2)埃(桥接至两个不同的六坐标Cu单元)和2.226(3)埃(游离)。细长的伪八面体和平面结构都归因于振动耦合。分子力学(MM),奥斯汀模型1(AM1)和扩展的Huckel(EH)计算表明,配位时会发生电子离域到噻吩基团。 [参考:50]

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