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首页> 外文期刊>International Journal of Solids and Structures >Mixed mode fracture toughness of adhesively bonded joints with residual stress
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Mixed mode fracture toughness of adhesively bonded joints with residual stress

机译:残余应力下胶接接头的混合模式断裂韧性

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Adhesively bonded double cantilever beam (DCB) test specimens with residual stress were manufactured. Deforming the adherends during the curing process caused the DCB specimens to curve due to the residual stress and shear load arose at the adhesive layer. Therefore, mixed mode fractures were generated by applying mode I loading to the specimens. The relation between the specimen curvature and the strain energy due to the residual stress was theoretically investigated and the mode II energy release rate for each specimen was calculated using measured specimen curvature. Because the mode I energy release rate for each specimen can be calculated with the DCB test result, the fracture toughness in mixed mode conditions was discussed. By manufacturing the specimens with different residual stresses, mixed mode fracture tests with various mixed mode ratios were conducted and the effect of the mixed mode ratio on the energy release rates was investigated. (C) 2016 Elsevier Ltd. All rights reserved.
机译:制备具有残余应力的胶粘双悬臂梁(DCB)测试样品。由于在粘合剂层上产生的残余应力和剪切负荷,在固化过程中使被粘物变形导致DCB试样弯曲。因此,通过对样品施加I型载荷而产生混合模式裂缝。理论上研究了样品曲率与残余应力引起的应变能之间的关系,并使用测得的样品曲率计算了每个样品的II型能量释放率。由于可以通过DCB测试结果计算出每个样品的I型能量释放率,因此讨论了混合模式条件下的断裂韧性。通过制造具有不同残余应力的样品,进行了各种混合模比的混合模断裂试验,并研究了混合模比对能量释放率的影响。 (C)2016 Elsevier Ltd.保留所有权利。

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