An improved three-dimensional inverse heat conduction procedure to determine the tool-chip interface temperature in dry turning

摘要

An improved three-dimensional inverse heat conduction procedure is proposed to quantitatively solve the steady-state tool-chip interface temperature in dry turning. The infrared method is utilized to measure the temperature on the rake face of the insert in transient cooling process after the feed motion is halted. With the experimentally measured temperature data, the 3-D heat conduction model of the cutter and an optimization scheme are used to solve the effective heat flux on tool-chip interface and the interface temperature during turning. This inverse procedure facilitates the determination of the temperature at tool-chip interface in dry turning process, which is still a challenge for existing experimental and numerical methods.