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Evaluation of Mechanical Characteristics of the Plate-Type Polymer Hyperfine Pit Pattern by the Nanoindentation Process

机译:纳米压痕法评价板型聚合物超细坑图案的力学性能

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It's important to measure quantitative properties about the thermal-nano behavior of polymers in order to produce high quality components using the nanoimprint lithography process. Nanoscale indentation can be used to make the cells for molecular electronics, drug delivery, slots for integration into nanodevices and defects for tailoring both the structure and properties. In this study, the formability of polymethylmetacrylate (PMMA) and polycarbonate (PC) were characterized. Thermo-mechanical properties during formation at a high temperature Polymers become softer at elevated temperature due to heating, In this case it is particularly important to study the high temperature-induced mechanical properties of the polymer, Nanoindentation was used to measure the thermo-mechanical properties of both PMMA and PC. The polymer was heated with the heating stage on a NanoXP. For a CSM (Continuous Stiffness Method) mode test, the heating temperature was 110℃, 120℃, 130℃, 140℃and 150℃for the PMMA, and 140℃, 150℃, 160℃, 170℃and 180℃for the PC. The maximum indentation depth for this test was 2000 nm. For the basic mode test, the heating temperature was 90℃ and 110℃ for the PMMA, and 140℃ and 160℃ for the PC. The maximum loads for this test were 10 mN, 20 mN and 40 mN, An indented pattern was also observed by using AFM, The pile-up phenomenon was mitigated due to the indentation at elevated temperature but the sink-in phenomenon occurred in this instance. When patterning at a high temperature, one should consider the variation in the indentation profile and depth after unloading when designing a structure. It was thought that the mechanical properties decrease when the working temperature increases because PMMA and PC are thermoplastics which soften or melt by heating. Further research in this area is required about the molecular weight and molecular movement at elevated temperature when the free volume of molecules increases.
机译:为了使用纳米压印光刻工艺生产高质量的组件,测量有关聚合物热纳米行为的定量特性非常重要。纳米级压痕可用于制造用于分子电子学,药物输送的槽,用于集成到纳米设备中的槽以及用于定制结构和性能的缺陷。在这项研究中,表征了聚甲基丙烯酸甲酯(PMMA)和聚碳酸酯(PC)的可成型性。高温下形成过程中的热机械性能聚合物由于加热而在高温下变得更软,在这种情况下,研究聚合物在高温下引起的机械性能尤为重要,使用了纳米压痕技术来测量其热机械性能。 PMMA和PC。在NanoXP上通过加热台加热聚合物。对于CSM(连续刚度法)模式测试,PMMA的加热温度为110℃,120℃,130℃,140℃和150℃,而PMMA的加热温度为140℃,150℃,160℃,170℃和180℃。电脑该测试的最大压痕深度为2000 nm。对于基本模式测试,PMMA的加热温度为90℃和110℃,PC的加热温度为140℃和160℃。该测试的最大载荷为10 mN,20 mN和40 mN,使用AFM还观察到了凹痕图案,由于高温下的凹痕而减轻了堆积现象,但在这种情况下发生了下沉现象。在高温下构图时,在设计结构时应考虑卸载后压痕轮廓和深度的变化。人们认为,当工作温度升高时,机械性能会下降,因为PMMA和PC是通过加热而软化或熔化的热塑性塑料。当分子的自由体积增加时,需要对高温下的分子量和分子运动进行进一步的研究。

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