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Quantitative analysis of visible surface defect risk in tablets during film coating using terahertz pulsed imaging

机译:使用太赫兹脉冲成像技术定量分析薄膜包衣过程中片剂可见表面缺陷的风险

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摘要

Tablets are the most common form of solid oral dosage produced by pharmaceutical industries. There are several challenges to successful and consistent tablet manufacturing. One well-known quality issue is visible surface defects, which generally occur due to insufficient physical strength, causing breakage or abrasion during processing, packaging, or shipping. Techniques that allow quantitative evaluation of surface strength and the risk of surface defect would greatly aid in quality control. Here terahertz pulsed imaging (TPI) was employed to evaluate the surface properties of core tablets with visible surface defects of varying severity after film coating. Other analytical methods, such as tensile strength measurements, friability testing, and scanning electron microscopy (SEM), were used to validate TPI results. Tensile strength and friability provided no information on visible surface defect risk, whereas the TPI-derived unique parameter terahertz electric field peak strength (TEFPS) provided spatial distribution of surface density/roughness information on core tablets, which helped in estimating tablet abrasion risk prior to film coating and predicting the location of the defects. TPI also revealed the relationship between surface strength and blending condition and is a nondestructive, quantitative approach to aid formulation development and quality control that can reduce visible surface defect risk in tablets.
机译:片剂是制药工业生产的最常见的固体口服剂型。成功和一致的平板电脑制造面临若干挑战。一个众所周知的质量问题是可见的表面缺陷,这些缺陷通常是由于物理强度不足而引起的,从而在加工,包装或运输过程中造成破裂或磨损。允许定量评估表面强度和表面缺陷风险的技术将大大有助于质量控制。在此,太赫兹脉冲成像(TPI)用于评估膜包衣后具有不同严重程度的可见表面缺陷的核心片剂的表面性能。其他分析方法,例如抗张强度测量,脆性测试和扫描电子显微镜(SEM),用于验证TPI结果。拉伸强度和脆性没有提供有关可见表面缺陷风险的信息,而TPI衍生的独特参数太赫兹电场峰值强度(TEFPS)提供了芯片剂表面密度/粗糙度信息的空间分布,这有助于在使用前评估片剂的磨损风险。涂膜并预测缺陷的位置。 TPI还揭示了表面强度与混合条件之间的关系,这是一种无损定量方法,有助于配方开发和质量控制,可降低片剂中可见的表面缺陷风险。

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