首页> 外文期刊>International Journal of Material Forming: Official Journal of the European Scientific Association for Material Forming - ESAFORM >On the influence of rolling path change on static recrystallization behavior of commercial purity aluminum
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On the influence of rolling path change on static recrystallization behavior of commercial purity aluminum

机译:轧制路径变化对工业纯铝静态再结晶行为的影响

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An examination of the influence of rolling path change on the static recrystallization behavior of commercial purity aluminum was performed in the present work. Aluminum strips were cold rolled to a reduction of 50% under various rolling sequences, i.e. single-pass, double-pass from one direction and with reverse directions, and were then annealed in 290℃ for different durations, while mechanical evaluations such as hardness and tensile tests were used to study the mechanical response of cold deformed and annealed samples. It was indicated that a variation in the recrystallization kinetics of the cold rolled aluminum strips takes place when the rolling path is altered from single to double-pass, and from forward to reverse directions. To express the obtained results and provide a more profound understanding of the flow behavior of rolling samples during deformation processing, combined finite element-dislocation models were taken into account, which were capable of predicting the deformation behavior of the aluminum strips and its consequence on the dislocation structure of the deformed metal. Using the proposed mathematical models, it was found that changing the rolling direction and/or sequence may result in the variation of strain field and dislocation density during cold rolling process, consequently affecting the subsequent restoration phenomena.
机译:在本工作中,研究了轧制路径变化对工业纯铝静态再结晶行为的影响。将铝带按各种轧制顺序冷轧至50%的压下率,即从一个方向和相反方向进行一次通过,两次通过,然后在290℃退火不同的时间,同时进行机械评估,例如硬度和拉伸试验用于研究冷变形和退火样品的机械响应。结果表明,当轧制路径从单道次改为双道次,从正向转变为反向时,冷轧铝带的再结晶动力学会发生变化。为了表示获得的结果并更深入地了解轧制样品在变形过程中的流动行为,考虑了有限元-位错组合模型,该模型能够预测铝带的变形行为及其对铝带变形的影响。变形金属的位错结构。使用所提出的数学模型,发现改变轧制方向和/或顺序可能导致冷轧过程中应变场和位错密度的变化,从而影响随后的恢复现象。

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