EVALUATION OF STRENGTH OF PLANE MICROCRACKED STRUCTURAL ELEMENTS VIA ELECTRICAL RESISTANCE SCANNING.

摘要

The paper focuses on experimental verification of a new approach to evaluate strength of structural elements via electrical resistance scanning. The approach utilizes explicit cross-property connections. In the case of multiple parallel cracks, we reconstruct certain characteristics of the microstructure from resistance measurements and evaluate the corresponding strength reduction. The results are compared to actual fracture tests of pre-configured specimens. Experimental strength measurements show strong correlation to the results predicted by the resistance scanning technique.