A facile method to prepare low-cost, highly conductive and reliable silver-coated copper (Ag-coated Cu) flakes filled isotropic conductive adhesive (ICAs) by in situ generation and sintering of silver nanoparticles (AgNPs) during the curing process is presented. The silver-triethanolamine complex is derived from the complexing reaction between AgNO3 and triethanolamine in the epoxy matrix. At the curing temperature, AgNPs are in situ generated by the thermal decomposition of silver-triethanolamine complex. The sintering of AgNPs anchored on the surface of Ag-coated Cu flakes could effectively prevent the exposed Cu from oxidizing. Compared with the ICAs without AgNPs which has a resistivity of 9.6 x 10~(-4) Ω cm, the ICAs filled with AgNPs shows a much lower volume resistivity of 6.62 x 10~(-4) Ω cm. Furthermore, the contact resistance of the ICAs is only 6.7% increase after aging at 85 °C and 85% RH for 500 h, while the increase in contact resistance of the controlled ICAs reaches to 23%. The facile approach will pave the way towards high performance and low cost ICAs for electronic packaging applications.
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机译:提出了一种通过在固化过程中原位生成和烧结银纳米颗粒(AgNPs)来制备低成本,高导电性和可靠的银包铜(Ag包铜)片状各向同性导电胶(ICAs)的简便方法。银-三乙醇胺络合物衍生自AgNO3与三乙醇胺在环氧基质中的络合反应。在固化温度下,银-三乙醇胺络合物的热分解可原位生成AgNP。固着在涂银的铜片表面的AgNPs的烧结可以有效地防止裸露的Cu被氧化。与没有AgNPs的ICA的电阻率为9.6 x 10〜(-4)Ωcm相比,填充有AgNPs的ICA的体积电阻率要低得多,为6.62 x 10〜(-4)Ωcm。此外,在85°C和85%RH下老化500小时后,ICAs的接触电阻仅增加6.7%,而受控ICAs的接触电阻则增加至23%。这种简便的方法将为电子封装应用的高性能和低成本ICA铺平道路。
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