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Enthalpies of mixing of liquid systems for lead free soldering: Co—Sb—Sn

机译:用于无铅焊接的液体系统混合焓:Co—Sb—Sn

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The partial and integral enthalpy of mixing of molten ternary Co—Sb-Sn alloys was determined performing high temperature drop calorimetry in a large compositional range at 1273 K. Measurements have been done along five sections, χ_(Sb)/χ_(Sn) ≈ 1:1,χ_(Sb)/χ__(Sn)≈ 1:3,χ__(Sb)/χ__(Sn) = 3:1,χ__(Co)/χ_(Sn) ≈ 1:4, and χ_(Co)/χ_(Sb) ≈ 1:5. Additionally, binary alloys of the constituent systems Co-Sb and Co-Sn were investigated at the same temperature. All the binary data were evaluated by means of a standard Redlich-Kister polynomial fit whereas ternary data were fitted on the basis of an extended Redlich—Kister—Muggianu model for substitutional solutions. An iso-enthalpy plot of the ternary system was constructed. In addition, the extrapolation Model of Toop was applied and compared to our data.
机译:熔融三元Co-Sb-Sn合金混合时的部分和整体焓是通过在1273 K的大成分范围内进行高温降热法来测定的。测量沿χ_(Sb)/χ_(Sn)五个部分进行1:1,χ_(Sb)/χ__(Sn)≈1:3,χ__(Sb)/χ__(Sn)= 3:1,χ__(Co)/χ_(Sn)≈1:4,而χ_(Co )/χ_(Sb)≈1:5。另外,在相同温度下研究了组成系统Co-Sb和Co-Sn的二元合金。所有二进制数据均通过标准Redlich-Kister多项式拟合进行评估,而三元数据则基于扩展Redlich-Kister-Muggianu模型的替代解决方案进行拟合。构造了三元系统的等焓图。另外,应用了Toop的外推模型并将其与我们的数据进行了比较。

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