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An Automated Laser Thermometer for Studying Plasma Processes in the Microtechnology

机译:用于研究微技术中等离子体过程的自动激光温度计

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摘要

The design and characteristics of an automated temperature sensor of dielectric and semiconductor substrates in apparatuses for film deposition and etching of microstructures are considered. The temperature is measured via the laser interference thermometry technique at wavelengths of 0.633 and 1.15 μm of a He-Ne laser. A signal-to-noise ratio of ~30 dB attained in the system is such that the device is sensitive to a change in the substrate temperature of 0.01 K. The heating and cooling of the wafer are recognized automatically and displayed via a graphic interface in real time. An interferogram recorded during substrate heating or cooling, the time dependence of the temperature after the discharge initiation, and the temperature dependence of the substrate-heating power are displayed on the monitor. For 0.5-mm-thick silicon substrates, the measurement range at a wavelength of 1.15 μm extends from cryogenic temperatures to 650 K.
机译:考虑了用于膜沉积和微结构蚀刻的设备中的电介质和半导体衬底的自动温度传感器的设计和特性。通过激光干涉测温技术在He-Ne激光器的0.633和1.15μm波长处测量温度。系统中的信噪比约为30 dB,因此该设备对0.01 K的基板温度变化敏感。自动识别晶片的加热和冷却,并通过图形界面显示。即时的。在监视器上显示在基板加热或冷却期间记录的干涉图,放电开始后温度的时间依赖性以及基板加热功率的温度依赖性。对于厚度为0.5毫米的硅基板,波长为1.15μm的测量范围从低温到650K。

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