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Design, Fabrication and Material Properties of Temperature Stable Performance Consistent Tunable Devices

机译:温度稳定性能一致的可调器件的设计,制造和材料性能

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摘要

The premier candidate active material for tunable microwave phase shifter devices is single composition, paraelectric BaSrTiO_3 (BST). However, there is concern that in practical applications the device performance will be compromised due to the temperature dependence of the BST based device capacitance. We report a device design which controls the magnitude and the sign of the temperature coefficient of capacitance (TCC) via a multilayer paraelectric BST/buffer layer/ferroelectric BST coplanar device structure. To realize this multilayer device structure we have designed, fabricated, and optimized a 10 mol% Al doped Ta_2O_5 barrier layer with low loss (tan ? = 0.004), moderate permittivity (epsilon_r = 42.8), low TCC (-20 ppm/°C), and a low bias stability of capacitance (0.4%). The thin film integration of the barrier layer with the BST layers was optimized for structure, microstructure, interfacial/surface morphology, and dielectric properties as a function of Al doping concentration, annealing temperature, material growth and integration process parameters.
机译:可调谐微波移相器设备的主要候选活性材料是单一成分顺电BaSrTiO_3(BST)。然而,担心的是,在实际应用中,由于基于BST的器件电容的温度依赖性,器件性能将受到损害。我们报告了一种器件设计,该器件通过多层顺电BST /缓冲层/铁电BST共面器件结构来控制电容温度系数(TCC)的大小和符号。为了实现这种多层器件结构,我们设计,制造和优化了10摩尔%的Al掺杂的Ta_2O_5势垒层,其损耗低(tanδ= 0.004),介电常数(epsilon_r = 42.8),低TCC(-20 ppm /°C) ),以及电容的低偏置稳定性(0.4%)。势垒层与BST层的薄膜集成针对Al掺杂浓度,退火温度,材料生长和集成工艺参数而优化了结构,微观结构,界面/表面形态和介电性能。

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