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High operating temperature SWIR p(+)-n FPA based on MBE-grown HgCdTe/Si(013)

机译:基于MBE生长的HgCdTe / Si(013)的高工作温度SWIR p(+)-n FPA

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摘要

The characteristics of SWIR (1.6-3 mu m) 320 x 256 and 1024 x 1024 focal plane arrays (FPA's) based on n-type In-doped HgCdTe heteroepitaxial layers are reported. The HgCdTe layers were grown by molecular beam epitaxy on silicon substrates with ZnTe and CdTe buffer layers. p-n junctions were formed by arsenic ion implantation into HgCdTe film. Reverse current in the temperature range from 210 to 330 K was found to be limited by the diffusion mechanism. At the same time in the temperature range from 140 to 210 K the reverse current was dominated by the thermal generation of charge carriers through deep traps located in the middle of the band gap. At 170 K NETD was less than 40 mK (C) 2016 Elsevier B.V. All rights reserved.
机译:报道了基于n型In掺杂HgCdTe异质外延层的SWIR(1.6-3μm)320 x 256和1024 x 1024焦平面阵列(FPA)的特性。通过分子束外延在具有ZnTe和CdTe缓冲层的硅基板上生长HgCdTe层。通过砷离子注入HgCdTe膜形成p-n结。发现在210至330 K的温度范围内的反向电流受到扩散机制的限制。同时,在140至210 K的温度范围内,反向电流被电荷载流子通过位于带隙中间的深陷阱所产生的热量所控制。 NETD在170 K时不到40 mK(C)2016 Elsevier B.V.保留所有权利。

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