首页> 外文期刊>Indian Journal of Chemical Technology >Optimization of preparation conditions for melamine urea formaldehyde based adhesive for plywood application using response surface methodology
【24h】

Optimization of preparation conditions for melamine urea formaldehyde based adhesive for plywood application using response surface methodology

机译:响应面法优化三聚氰胺脲醛胶合板胶的制备条件

获取原文
获取原文并翻译 | 示例
           

摘要

Filler is added to adhesive formulations to reduce resin utilization leading to cost savings. Melamine urea formaldehyde (MUF) resin has been synthesized in the laboratory. The palm kernel meal (PKM) and palm shell (PS) are used as fillers to formulate the melamine urea formaldehyde (MUF) resin based adhesive for interior plywood manufacturing. These formulations are compared with commercialized industry wheat flour (IF) filler. Response surface methodology (RSM) is used for identification of the optimum temperature and pressing time for wood adhesive performance. The experiments have been conducted in the temperature range from 100 to 150 degrees C and pressing time from 50 s to 250 s. The result indicates that the effect of the filler type on plywood shear strength and formaldehyde emission is significant. The optimum shear strength and formaldehyde emission performance of PKM, IF and PS are 1.41 MPa, 1.30 MPa, 1.21 MPa and 0.9988 mg/L, 0.5345 mg/L, 1.2735 mg/L respectively. In addition, the optimum hot press temperature and time of PKM, IF and PS are 124.9 degrees C, 130.9 degrees C, 127.9 degrees C and 156 s, 153 s, 149 s respectively. This work concludes that, PKM based MUF adhesive resins exhibit potential applications involved in plywood production.
机译:将填料添加到粘合剂配方中以减少树脂利用率,从而节省成本。三聚氰胺脲甲醛(MUF)树脂已在实验室合成。棕榈仁粕(PKM)和棕榈壳(PS)用作填充剂,用于配制用于室内胶合板制造的三聚氰胺脲醛(MUF)树脂基粘合剂。将这些配方与商业化的工业小麦粉(IF)填料进行比较。响应表面法(RSM)用于确定木材胶粘剂性能的最佳温度和压制时间。实验是在100至150摄氏度的温度范围内以及50 s至250 s的加压时间下进行的。结果表明,填料类型对胶合板剪切强度和甲醛释放量的影响显着。 PKM,IF和PS的最佳剪切强度和甲醛释放性能分别为1.41 MPa,1.30 MPa,1.21 MPa和0.9988 mg / L,0.5345 mg / L,1.2735 mg / L。此外,PKM,IF和PS的最佳热压温度和时间分别为124.9摄氏度,130.9摄氏度,127.9摄氏度和156 s,153 s,149 s。这项工作得出的结论是,基于PKM的MUF粘合剂树脂具有胶合板生产的潜在应用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号