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机译:多孔copper-graphene异质结构为电子设备的冷却
Seoul Natl Univ, Dept Text Merchandising & Fash Design, Seoul 08826, South Korea;
Korea Inst Sci & Technol, Inst Adv Composite Mat, Wonju 55324, Joellabuk Do, South Korea;
Chonnam Natl Univ, Dept Adv Chem & Engn, Gwangju 61186, South Korea;
Thermal Conductivity; waste heat; luminanceCopper powderOptoelectronic devicesCopperPorousOptical DevicesElectron devicesHeat generationHeterostructuresheat dissipation performanceOvercurrentLight emitting diodesheat sinks;
机译:使用京都大学,Rico-Electronic Device,Nichicon太阳能电池开发独立电源IOT环境传感器系统
机译:TDK Electronic Devices•与美国Immersion公司就材料触摸技术达成联合营销协议
机译:Electronic Devices Sangyo Shimbun举办的研讨会“半导体的发展” 2016年1月18日
机译:会议论文集2002 IEEE Hong Kong Electronic Devices Meeting
机译:Two-Dimensional Electronic Materials and Devices: Opportunities and Challenges =二维电子材料与器件:机会与挑战
机译:巴西苦Cool属植物的多样性和毒性以及热带苦Cool中44-甲基甘比那酮的检测
机译:nitride wideband gap semiconductor material and electronic device设备YY UE ha O, jin-F鞥Zhang, and jin-Cheng Zhang
机译:studies of ferroelectric heterostructure thin films and interfaces via in situ211 analytical techniques