机译:开发N〜+-In-P Planar像素像素QuadSensor flip-Chiped用Fe-i4读数ASIC
Department of Physics, Ochanomizu University, 2-1-1 Otsuka, Bunkyo-ku, Tokyo 112-8610, Japan;
Institute of Particle and Nuclear Study, KEK, 1-1 Oho, Tsukuba, Ibaraki 305-0801, Japan;
Ochadai Academic Production, Ochanomizu University, 2-1-1 Otsuka, Bunkyo-ku, Tokyo 112-8610, JapanInstitute of Science and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 152-8551, JapanDepartment of Physics, Faculty of Science, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka 819-0395, JapanDepartment of Science Education, Kyoto University of Education, 1 FukakusaFujimori-cho, Fushimi-ku, Kyoto 612-8522, JapanInstitute of Pure and Applied Sciences, University of Tsukuba, Tsukuba, Ibaraki 305-8571, Japan;
Deficiency; indium bump; pixelreadoutMass productionbonding technologySensorssoldering fluxSOLDER BUMPSPlanarSoldering alloys;
机译:N〜+ -IN-P平面像素Quadsensor的开发与FE-I4读数ASIC一起翻转
机译:ATLAS Pixel IBL检测器的FE-I4前端芯片中的总电离剂量效应
机译:New Atlas Pixel Chip Fe-I4的数字架构
机译:用于atlas pixel中光学数据传输的辐射 - 硬质asics 探测器