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首页> 外文期刊>Progress in photovoltaics >High-quality amorphous silicon thin films for tunnel oxide passivating contacts deposited at over 150 nm/min
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High-quality amorphous silicon thin films for tunnel oxide passivating contacts deposited at over 150 nm/min

机译:用于隧道氧化物钝化触点沉积在150 nm / min的高质量非晶硅薄膜

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摘要

Hot-wire chemical vapor deposition was utilized to develop rapidly grown and high-quality phosphorus-doped amorphous silicon (a-Si:H) thin films for poly-crystalline silicon on tunnel oxide carrier-selective passivating contacts. Deposition rates higher than 150 nm/min were obtained for the in situ phosphorus-doped a-Si:H layers. To optimize the passivating contact performance, material properties such as microstructures as well as hydrogen content were characterized and analyzed for these phosphorus-doped a-Si:H films. The results show that a certain microstructure of the films is crucial for the passivation quality and the conductance of passivating contacts. Porous silicon layers were severely oxidized during high-temperature crystallization, giving rise to very low conductance. The insufficient effective doping concentration in these layers also yields inferior passivation quality due to lack of field-effect passivation. On the other hand, dense silicon layers are insensitive to oxidation but very sensitive to blistering of the films during the subsequent high-temperature process steps. By optimizing the deposition parameters, a firing-stable-implied open-circuit voltage of 737 mV and a contact resistivity of 10 m omega center dot cm(2)were achieved at a high deposition rate of 100 nm/min while 733 mV and 90 m omega center dot cm(2)were achieved at an even higher deposition rate of 150 nm/min.
机译:利用热线化学气相沉积技术,在隧道氧化物载体选择性钝化触点上制备了快速生长的高质量掺磷非晶硅(a-Si:H)薄膜。原位磷掺杂的a-Si:H薄膜的沉积速率高于150nm/min。为了优化钝化接触性能,对这些掺磷a-Si:H薄膜的微观结构和氢含量等材料性能进行了表征和分析。结果表明,一定的薄膜微观结构对钝化质量和钝化触点的导电性至关重要。多孔硅层在高温结晶过程中被严重氧化,导致电导率非常低。由于缺乏场效应钝化,这些层中的有效掺杂浓度不足也会产生较差的钝化质量。另一方面,致密硅层对氧化不敏感,但在随后的高温工艺步骤中对薄膜起泡非常敏感。通过优化沉积参数,在100 nm/min的高沉积速率下获得了737 mV的点火稳定隐含开路电压和10 mΩ中心点cm(2)的接触电阻率,而在150 nm/min的更高沉积速率下获得了733 mV和90 mΩ中心点cm(2)。

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