Materials Optimization Technology for Efficiently Designing Strong-Adhesion Interfaces by Use of Orthogonal Array and Response-Surface Method

摘要

In these days, new functional materials (for example, high-permittivity ceramics and giant magnetoresistive materials) are used in electronic devices such as semiconductor ultra-large-scale-integrated circuits (ULSIs) and magnetic sensors. So, a lot of interfaces between different materials exist in the devices. If one of the interfaces are weak, an adhesive fracture occurs at the interface. For this reason, the adhesion of all interfaces have to be strong enough to prevent adhesive fractures. Thus, selecting appropriate materials with strong adhesion strength is one of the keys to preventing adhesive fractures. For example, selecting titanium (Ti) as a barrier underlayer for aluminum (Al) interconnect films in ULSIs is effective for preventing adhesive fractures, because titanium is well known to have strong adhesion to aluminum. However, it is difficult to find such appropriate materials only by experimental trial and error.