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机译:不同环境下SN-AL合金涂层SN晶须和小丘的生长行为的比较研究
Southeast Univ Sch Mat Sci &
Engn Jiangsu Key Lab Adv Metall Mat Nanjing 211189 Peoples R China;
LG Chem Nanjing Informat &
Elect Mat Co Ltd Nanjing 211167 Peoples R China;
Southeast Univ Sch Mat Sci &
Engn Jiangsu Key Lab Adv Metall Mat Nanjing 211189 Peoples R China;
Southeast Univ Sch Mat Sci &
Engn Jiangsu Key Lab Adv Metall Mat Nanjing 211189 Peoples R China;
Nanjing Inst Technol Sch Mat Sci &
Engn Jiangsu Key Lab Adv Struct Mat &
Applicat Technol Nanjing 211167 Peoples R China;
Southeast Univ Sch Mat Sci &
Engn Jiangsu Key Lab Adv Metall Mat Nanjing 211189 Peoples R China;
Southeast Univ Sch Mat Sci &
Engn Jiangsu Key Lab Adv Metall Mat Nanjing 211189 Peoples R China;
Sn whisker; Sn-Al coating; Residual stress; Crystal orientation; Finite element simulation;
机译:温度和湿度对锡5Nd合金锡晶须和小丘生长的影响
机译:不同环境下Sn-0.3Ag-0.7Cu-1Pr焊料中锡晶须生长微电子可靠性问题的比较研究
机译:Sn和Sn合金无铅表面处理剂的晶须生长行为
机译:锡晶须在Sn-Al涂层上的生长行为
机译:局部薄膜性质对锡晶须和小丘成核和生长的影响
机译:超声波辅助钎焊在Mg / Sn基钎料/ Mg接头中快速形成和生长高密度锡晶须:现象机理和预防方法
机译:五种不同电缆托盘涂层中的Hillock和锌晶须演化研究
机译:固体生长合金纤维晶体(晶须)生长机理的研究