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Ni-Mo-S Ternary Chalcogenide Thin Film for Enhanced Hydrogen Evolution Reaction

机译:Ni-MO-S三元硫属化物薄膜,用于增强氢气进化反应

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摘要

Transition metal dichalcogenides (TMDs) hold a great promise to replace Pt-based catalysts for hydrogen evolution reaction (HER). Among those, MoS2 has been the center of attention. In this work, we investigate the effect of Ni addition on the catalytic activity of MoS2 thin film in HER. Ni-Mo-S ternary chalcogenide thin films with varying Ni concentrations were fabricated by a two-step process: co-sputtering of Ni-Mo alloy films and thermal sulfurization. The HER performance of MoS2 (620 mV overpotential and 138 mV dec(-1) Tafel slope) is surpassed by the resulting ternary chalcogenides, among which the Ni-Mo-S film at 50 at.% Ni concentration exhibits the highest catalytic activity with an overpotential of 400 mV at 10 mA cm(-2) and Tafel slope of 81 mV dec(-1). The Ni addition promotes HER kinetics by altering the morphology and electronic structure of MoS2 thin film, leading to improved H+ ion adsorption, reduced charge transfer resistance and increased electrochemical surface area. This study provides a method for the controllable fabrication of ternary chalcogenide thin films and paves the way for the exploration of new combinations of ternary TMDs.
机译:过渡金属二卤化物(TMD)有望取代铂基催化剂用于析氢反应(HER)。其中,MoS2一直是人们关注的焦点。在这项工作中,我们研究了在HER中添加镍对MoS2薄膜催化活性的影响。采用Ni-Mo合金薄膜共溅射和热硫化两步法制备了不同Ni浓度的Ni-Mo-S三元硫系薄膜。MoS2的HER性能(620 mV过电位和138 mV dec(-1)Tafel斜率)超过了由此产生的三元硫系化合物,其中Ni-Mo-S薄膜在50 at.%镍浓度表现出最高的催化活性,在10mA-cm(-2)下的过电位为400mV,塔菲尔斜率为81mV-dec(-1)。Ni的加入通过改变MoS2薄膜的形态和电子结构来促进其动力学,从而改善H+离子吸附,降低电荷转移电阻并增加电化学表面积。本研究为三元硫系薄膜的可控制备提供了一种方法,为探索三元TMD的新组合铺平了道路。

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