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Mechanically Guided Assembly of Monolithic Three-Dimensional Structures from Elastomer Composites

机译:从弹性体复合材料机械引导组装整体三维结构

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Mechanically guided assembly is considered a facile and scalable methodology for fabrication of three-dimensional (3D) structures. However, most of the previous methods require multistep processes for bonding bi- or multilayers and only result in non-freestanding 3D structures because of usage of a supporting elastomer substrate. Herein, we report a functional elastomer composite that can be transformed to a freestanding and monolithic 3D structure driven by the mechanically guided assembly. Photolithography can be used to selectively tune the mechanical properties of UV-exposed regions which exhibit enhanced ductility compared with the nonexposed regions. Thus, a gradient of the residual strain in the thickness direction makes the films assemble into 3D structures. These 3D structures are also predicted by our computational models using finite element simulations, which yields a reasonable agreement with the experiments. The systematically designed 2D structures with varied patterns can be transformed to various 3D structures with the control of the residual strain gradient, via key processing parameters including pre-strain, film thickness, and UV exposure time. By integrating different active electronic components on the fabricated 3D structures, potential applications of this 3D platform in electronics were demonstrated. This study offers a unique capability in constructing monolithic and freestanding 3D assembly, paving new routes to many applications such as wearable electronics, smart textiles, soft robotics, and structural health monitoring.
机译:机械导向组件被认为是一种适用于制造三维(3D)结构的容易和可伸缩的方法。然而,最前面的方法需要多层工艺来粘合Bi或多层,并且由于使用支撑弹性体衬底而产生非独立的3D结构。在此,我们报告了一种功能性弹性体复合材料,其可以转换为由机械引导组件驱动的独立和单片3D结构。光刻可用于选择性地调节紫外线暴露区域的机械性能,与未引入区域相比表现出增强的延展性。因此,厚度方向上的残余应变的梯度使膜组装成3D结构。我们的计算模型也使用有限元模拟来预测这些3D结构,其产生与实验合理的协议。通过控制残余应变梯度,通过包括预缠结,膜厚度和紫外线暴露时间的钥匙处理参数,可以改变具有变化模式的系统设计的2D结构。通过将不同的有源电子元件集成在制造的3D结构上,证明了该3D平台在电子器件中的潜在应用。本研究提供了独特的能力,在整体和独立的3D组件构建,为许多应用程序铺平了新的路线,如可穿戴电子产品,智能纺织品,软机器人和结构健康监测。

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