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Ordered AlxGa1-xAs Nanopillar Arrays via Inverse Metal-Assisted Chemical Etching

机译:通过反转金属辅助化学蚀刻订购Alxga1-XAS纳米玻璃阵列

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摘要

The ternary III-V semiconductor compound, AlxGa1-xAs, is an important material that serves a central role within a variety of nanoelectronic, optoelectronic, and photovoltaic devices. With all of its uses, the material itself poses a host of fabrication difficulties stemming from conventional top-down processing, including standard wet-chemical etching and reactive-ion etching (RIE). Metal-assisted chemical etching (MacEtch) techniques provide low-cost and benchtop methods that combine many of the advantages of RIE and wet-chemical etching, without being hindered by many of their disadvantages. Here, inverse-progression MacEtch (I-MacEtch) of Au-patterned AlxGa1-xAs is demonstrated for the first time and is exploited for the generation of vertical and ordered nanopillar arrays. The etching solution employed here consists of citric acid (C6H8O7) and hydrogen peroxide (H2O2). The I-MacEtch evolution is tracked in time for AlxGa1-xAs samples with compositions defined by x = 0.55, x = 0.60, and x = 0.70. The vertical and lateral etch rates (VER and LER, respectively) are shown to be tunable with Al fraction and temperature of the etching solution, based on modification of catalytically injected hole distributions. Control over the VER/LER ratio is demonstrated by tailoring etch conditions for single-step fabrication of ordered AlGaAs nanopillar arrays with predefined aspect ratios. Maximum VER and LER values of similar to 40 nm/min and similar to 105 nm/min, respectively, are measured for Al0.55Ga0.45As at a process temperature of 65 degrees C. The I-MacEtch nanofabrication methodology outlined in this study may be utilized for the processing of many devices, including high electron mobility transistors, distributed Bragg reflectors, lasers, light-emitting diodes, and multijunction solar cells containing AlGaAs components.
机译:三元III-V半导体化合物AlxGA1-XA是一种重要的材料,其在各种纳米电子,光电和光伏器件内存在核心作用。通过其所有用途,材料本身摆在传统的自上而下处理中源于传统的自上而下处理的困难,包括标准湿化学蚀刻和反应离子蚀刻(RIE)。金属辅助化学蚀刻(MACETCH)技术提供了低成本和台式方法,可以结合RIE和湿化学蚀刻的许多优点,而不会受到许多缺点的阻碍。这里,首次对AU图案化的ALXGA1-XA的反向进展掩蚀(I-MEMETCH)进行说明,并且被利用用于产生垂直和有序的纳米玻璃阵列。这里使用的蚀刻溶液由柠檬酸(C6H8O7)和过氧化氢(H 2 O 2)组成。对于Alxga1-XA样本的时间跟踪I-MASETCH EVOLUTION,与X = 0.55,x = 0.60,x = 0.70定义的组合物的ALXGA1-XAS样品跟踪。基于催化注入孔分布的改变,显示垂直和横向蚀刻速率(分别分别)与蚀刻溶液的Al分数和温度进行可调谐。通过纵向蚀刻条件对具有预定六个纵横比的单步制造的蚀刻条件来证明对Ver / Ler比的控制。在65摄氏度的过程温度下,分别测量类似于40nm / min和类似于105nm / min的最大VER和LER值和类似于105nm / min的。本研究中概述的I-MASECT纳米制作方法可能用于处理许多设备,包括高电子迁移率晶体管,分布式布拉格反射器,激光器,发光二极管和包含Algaas组件的多结太阳能电池。

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