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Hot-pressing sintered BN-SiO2 composite ceramics with excellent thermal conductivity and dielectric properties for high frequency substrate

机译:热压烧结BN-SiO2复合陶瓷,具有优异的热导电性和高频基板的电介质性能

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摘要

High thermal conductivity and low dielectric constant are the more and more important properties for high-frequency substrate materials to enhance their heat radiation and reduce signal delay. In this work, a series of BN-SiO2 composite ceramics for high frequency application were successfully synthesized by hot-pressing sintering method. And their structures, thermal and dielectric properties were systematically studied. According to the results, the excellent thermal conductivity with low dielectric constant and low dielectric loss has been obtained in the BN-SiO2 ceramic. Compared to the pure SiO2, the sample with 50 wt% BN addition sintered at 1650 degrees C exhibited excellent physical properties, including a high thermal conductivity of 6.75 W/m K which is almost five times higher than that of pure SiO2 and a low dielectric constant of 3.73. The achieved high thermal conductivity and appropriate dielectric property of the BN-SiO2 composite ceramic make it a promising candidate for high-frequency substrate application.
机译:高导热率和低介电常数是高频衬底材料的越来越重要的特性,以增强它们的热辐射并降低信号延迟。在这项工作中,通过热压烧结方法成功地合成了一系列用于高频施用的BN-SiO2复合陶瓷。及其结构,热和介电性能得到了系统地研究。根据结果​​,在BN-SiO2陶瓷中获得了具有低介电常数和低介电损耗的优异导热率。与纯SiO 2相比,具有50wt%BN加入的样品在1650℃下烧结烧结,具有优异的物理性质,包括6.75W / m k的高导热率,其几乎高于纯SiO2和低电介质的5倍。常数为3.73。 BN-SiO2复合陶瓷的高导热率和适当的介电性能使其成为高频衬底应用的有希望的候选者。

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