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Surface topography and roughness of silicon carbide ceramic matrix composites

机译:碳化硅陶瓷基复合材料的表面形貌和粗糙度

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摘要

The silicon carbide ceramic matrix composite (C-f/SiC) plays an important role in aeronautic and space applications due to its excellent performance. C-f/SiC consists of silicon carbide and carbon fibers. The effects of the grinding parameters on the 3D parameters of surface roughness and surface topography when grinding 2.5D needled C-f/SiC materials have rarely been investigated. The primary purpose of this paper is to fill this knowledge gap. C-f/SiC material was ground in the direction of the orthogonal surface, and the surface topography, grinding parameters and grinding mechanism were analysed through a series of experiments. The results indicated that matrix cracks, fiber fractures, fiber wear and interfacial debonding were the primary removal methods of the material. The grinding parameters exert a substantial influence on the quality of the machined surface, primarily because of the undeformed chip thickness and the length of the contact arc. In the grinding process of the 2.5D C-f/SiC material, the quality of the surface roughness and its parameters gradually improved with increasing grinding speed, whereas the feed speed and grinding depth produced the opposite effect. Based on the conclusions, the surface topography and roughness parameters of 2.5D C-f/SiC material can be predicted, which thus provides useful technical support for increasing the machining quality of 2.5D C-f/SiC material and all its composites.
机译:碳化硅陶瓷基质复合材料(C-F / SIC)由于其优异的性能,在航空和空间应用中起着重要作用。 C-F / SIC由碳化硅和碳纤维组成。磨削参数对磨削2.5d针刺C-F / SiC材料的表面粗糙度和表面形貌的3D参数的影响很少。本文的主要目的是填补这种知识差距。通过一系列实验分析C-F / SiC材料沿正交表面的方向接地,表面形貌,研磨参数和研磨机制。结果表明,基质裂缝,纤维裂缝,纤维磨损和界面剥离是材料的主要去除方法。研磨参数对加工表面的质量产生了大量影响,主要是因为未变形的芯片厚度和接触弧的长度。在2.5D C-F / SIC材料的研磨过程中,表面粗糙度的质量及其参数随着磨削速度的增加而逐渐提高,而进料速度和研磨深度产生相反的效果。根据结论,可以预测2.5D C-F / SIC材料的表面形貌和粗糙度参数,从而提供了用于增加2.5D C-F / SIC材料和所有复合材料的加工质量的有用技术支持。

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