Microstructure and mechanical properties of Ti3SiC2/Ti3SiC2 diffusion bonded joints using Ti foil as an interlayer

摘要

Diffusion bonded joints of Ti3SiC2 ceramic without or with a Ti foil were fabricated. The effects of temperature, holding time and Ti foil thickness on the microstructural evolution and mechanical properties of Ti3SiC2/Ti/Ti3SiC2 joints were systematically investigated. Compared with the case of direct diffusion joints, the Ti3SiC2/Ti/Ti3SiC2 joint was obtained at 1000 degrees C and the bonding temperature reduced by 150 degrees C. The typical microstructure of the Ti3SiC2/Ti/Ti3SiC2 joints obtained at 1100 degrees C with a 60-mu m thick Ti foil for 60 min consisted of Ti3SiC2/Ti(5)Si(3)c/TiSi/Ti5Si4/TiAl2/TiAl/