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首页> 外文期刊>日本応用磁気学会誌 >Preparation of AlN films as insulation gap layers for MR heads by magnetron sputtering enhanced with an inductively coupled rf plasma
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Preparation of AlN films as insulation gap layers for MR heads by magnetron sputtering enhanced with an inductively coupled rf plasma

机译:用电感耦合的射频等离子体增强MR头作为MR头的绝缘间隙层的制备。

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摘要

AlN films for use as insulative gap layers for MRor GMR heads were prepared by magnetron sputtering enhancedwith an inductively coupled rf plasma at various substratetemperatures. AlN films deposited on substrates at roomtemperature were found to have amorphous structure and topossess poor corrosion resistance to hot water. On the other hand,AlN films prepared on 200 deg C substrates were crystallized tosome extent and displayed good corrosion resistance. All the AlNfilms, regardless of the substrate temperature, behaved asinsulators. The breakdown electric fields of the AlN films wereall about 0.6 GV/m and leakage currents were about 10~(-8)A/mm~2 (10V). The AlN films prepared at 200 deg C concludedto be suitable for application in MR and GMR heads.
机译:用于使用的ALN薄膜作为MRORGMR头的绝缘间隙层由磁控溅射增强,其在各种副作用处具有电感耦合的RF等离子体。 发现沉积在室温下的底物上的ALN薄膜具有无定形结构和ToTossess对热水的耐腐蚀性差。 另一方面,在200℃的基材上制备的ALN薄膜在结晶的带设计程度并显示出良好的耐腐蚀性。 所有alnfilms,无论衬底温度如何,表现为均匀。 ALN薄膜的击穿电场约为0.6 GV / m和漏电流为约10〜(-8)A / mm〜2(10V)。 在200℃下准备的ALN薄膜结束,适用于MR和GMR头的应用。

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