Novel nondestructive and non-contact chip inspection and analysis technique: scanning laser-SQUID microscopy

摘要

We have developed a novel inspection/analysis technique that can localize electrical defects such as short gates and open lines. Basic idea of the technique is a detection of magnetic field produced by laser-beam-induced current. High T{sub}c DC-SQUIDs are used to detect magnetic field. The spatial resolution has been demonstrated to be better than 1.3μm. This shows that this method is applicable to the inspection and analysis on LSI chips. The demonstration simulated the fault localization on a bare chip mounted on a board. How to apply this method to other types of failure analysis, inspection and process monitoring was proposed.