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Crack healing behaviour of silicon nitride ceramics: effect of sintering additives and starting powders

机译:氮化硅陶瓷的裂纹愈合行为:烧结添加剂和起始粉末的影响

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In the present work, the difference in crack healing behaviour of five kinds of silicon nitride with different starting powder and sintering additives, and Si{sub}3N{sub}4/ SiC composites is studied. The semicircular crack(average diameter was100μm) was introduced in the center of specimens, then specimens were heat treated at 1300°C for 1 hour in air or in vacuum. Bending strength was measured at room and elevated temperature up to 1200°C by 3-point bending test system. Bending strength ofcracked specimen reduced to 36-59% of that of smooth specimen. However, bending strength of all monolithic silicon nitride heat treated in air at 1300°C increased since pre-crack was healed due to oxidation. In case of Si{sub}3N{sub}4/Y{sub}2O{sub}3,especially the bending strength recovered completely up to that of smooth specimen. Bending strength of cracked and heat treated Si{sub}3N{sub}4/SiC composites recovered completely up to that of smooth specimen and crack healed part has enough strength up to 1200°C.
机译:在本作工作中,研究了五种氮化硅与不同起始粉末和烧结添加剂的裂纹愈合行为的差异,以及Si {Sub} 3N {Sub} 4 / SiC复合材料。在标本的中心引入半圆形裂纹(平均直径为100μm),然后在1300℃下在空气中或真空处理试样。在室内测量弯曲强度,并通过3点弯曲测试系统在高达1200°C的温度下测量。弯曲的标本弯曲强度降至平滑标本的36-59%。然而,在1300℃下在空气中处理的所有单片氮化硅热的弯曲强度增加,因为预裂纹由于氧化而愈合。在SI {sub} 3n {sub} 4 / y {sub} 2o {sub} 3的情况下,尤其是弯曲强度完全恢复到平滑标本的弯曲强度。裂化和热处理的弯曲强度Si {Sub} 3N {Sub} 4 / SiC复合材料完全恢复到平滑样品和裂纹愈合部分的裂纹愈合部分具有足够的强度,高达1200°C。

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