100 kHz thermosonic wire bonding technology

摘要

The increasing 110 counts of IC chips and chip size shrinkage require fine-pitch wire bonding technology for the interconnection of gold wire to aluminum pads on ICs. On the other hand, sufficient wire bond strength at low temperatures isrequired in the fabrication of IC packages with a resin substrate.We have developed a high-speed wire bonder to achieve thermosonic bonding at a high frequency of 103 kHz, and investigated the relationships between bond deformation and strength at 63 kHz and 103 kHz. As a result, it was clarified that high-frequencythermosonic bonding at 103 kHz is effective in obtaining higher strength bonds with small deformation at low temperatures.