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Highly Stable and Tunable Chemical Doping of Multi layer WS2 Field Effect Transistor: Reduction in Contact Resistance

机译:多层WS2场效应晶体管的高度稳定和可调化学掺杂:降低接触电阻

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The development of low resistance contacts to 2D transition-metal dichalcogenides (TMDs) is still a big challenge for the future generation field effect transistors (FETs) and optoelectronic devices. Here, we report a chemical doping technique to achieve low contact resistance by keeping the intrinsic properties of few layers WS2. The transfer length method has been used to investigate the effect of chemical doping on contact resistance. After doping, the contact resistance (R-c) of multilayer (ML) WS2 has been reduced to 0.9 k Omega center dot mu m. The significant reduction of the R-c, is mainly due to the high electron doping density, thus a reduction in Schottky barrier height, which limits the device performance. The threshold voltage of ML-WS2 FETs confirms a negative shift upon the chemical doping, as further confirmed from the positions of E-2g(1) and A(1g) peaks in Raman spectra. The n-doped samples possess a high drain current of 65 mu A/mu m, with an on/off ratio of 1.05 x 10(6) and a field effect mobility of 34.7 cm(2)/(V.s) at room temperature. Furthermore, the photoelectric properties of doped WS2, flakes were also measured under deep ultraviolet light. The potential of using LiF doping in contact engineering of TMDs opens new ways to improve the device performance.
机译:对于下一代场效应晶体管(FET)和光电器件而言,向2D过渡金属二卤化金属(TMD)的低电阻触点的开发仍然是一个巨大的挑战。在这里,我们报告了一种化学掺杂技术,该技术通过保持少量WS2层的固有特性来实现低接触电阻。转移长度法已被用于研究化学掺杂对接触电阻的影响。掺杂后,多层(ML)WS2的接触电阻(R-c)已降至0.9 k Omega中心点μm。 R-c的显着降低主要归因于高电子掺杂密度,从而降低了肖特基势垒高度,从而限制了器件性能。 ML-WS2 FET的阈值电压证实了化学掺杂时的负向偏移,这从拉曼光谱中E-2g(1)和A(1g)峰的位置进一步得到证实。 n掺杂的样品具有65μA/μm的高漏极电流,开/关比为1.05 x 10(6),在室温下的场效应迁移率为34.7 cm(2)/(V.s)。此外,还在深紫外光下测量了掺杂的WS2薄片的光电性能。在TMD的接触工程中使用LiF掺杂的潜力为改善器件性能开辟了新途径。

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