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EBSD coupled to SEM in situ annealing for assessing recrystallization and grain growth mechanisms in pure tantalum

机译:EBSD耦合到SEM原位退火,用于评估纯钽中的重结晶和晶粒生长机制

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An in situ annealing stage has been developed in-house and integrated in the chamber of a Scanning Electron Microscope equipped with an Electron BackScattered Diffraction system. Based on the Joule effect, this device can reach the temperature of 1200°C at heating rates up to 100°C/s, avoiding microstructural evolutions during heating. A high-purity tantalum deformed sample has been annealed at variable temperature in the range 750°C-1030°C, and classical mechanisms of microstructural evolutions such as recrystallization and grain coarsening phenomena have been observed. Quantitative measurements of grain growth rates provide an estimate of the mean grain boundary mobility, which is consistent with the value estimated from physical parameters reported for that material. In situ annealing therefore appears to be suited for complementing bulk measurements at relatively high temperatures, in the context of recrystallization and grain growth in such a single-phase material.
机译:在原位退火阶段已经在内部开发并集成在配备有电子背散射衍射系统的扫描电子显微镜的腔室中。 基于焦耳效应,该装置可在加热速率下达到1200℃的温度,高达100°C / s,避免加热过程中的微观结构演进。 在750℃-1030℃的可变温度下,在750℃-1030℃的可变温度下退火了高纯度钽变形样品,并且已经观察到诸如重结晶和晶粒粗化现象的微观结构演进的经典机制。 晶粒生长速率的定量测量提供了平均晶界移动性的估计,这与来自该材料报告的物理参数估计的值一致。 因此,在这种单相材料的重结晶和晶粒生长的背景下,原位退火似乎适用于在相对高的温度下互补体积测量。

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