首页> 外文期刊>Journal of Materials Engineering and Performance >Microstructure Evolution and Microhardness Distribution of Copper Processed Using Multiple Passes of Elliptical Cross-Sectional Spiral Equal-Channel Extrusion
【24h】

Microstructure Evolution and Microhardness Distribution of Copper Processed Using Multiple Passes of Elliptical Cross-Sectional Spiral Equal-Channel Extrusion

机译:利用椭圆形横截面螺旋等通道挤出多通铜加工的微观结构演化与微硬度分布

获取原文
获取原文并翻译 | 示例
           

摘要

The aim of this work is to study the effect of six-pass elliptical cross-sectional spiral equal-channel extrusion (ECSEE) on the microstructure and performance of ultrafine-grained (UFG) copper. Equiaxed grains of average grain size of less than 1m are formed into shear bands in the low strain region of ECSEE deformed specimen. More homogeneous and equiaxed microstructure with high misorientation angles is obtained in the high strain. Moreover, the microstructure evolution of ECSEE-induced copper is a dynamic equilibrium process of shear deformation accompanying the interactions of high dislocation density, cellular structure and high-angle grain boundaries. The grain ECSEE refinement mechanism is described as the formation process of dislocations, cells, local grain sub-boundaries rotation and large angle grain restructure. The significantly non-uniform hardness distribution is consistent with the deformation behavior and microstructure refinement in the ECSEE-induced specimen. The homogeneity of microstructure and hardness improves as the ECSEE pass increases.
机译:这项工作的目的是研究六遍椭圆形横截面螺旋等通道挤出(ECSEE)对超细晶粒(UFG)铜的微观结构和性能的影响。平均晶粒尺寸小于1m的等轴晶粒在Ecsee变形样品的低应变区中形成剪切带。在高菌株中获得具有高错位角的更均匀和等式的微观结构。此外,Ecsee诱导的铜的微观结构演化是伴随高位错密度,蜂窝结构和大角晶界相互作用的剪切变形的动态平衡过程。谷物Ecsee细化机制被描述为位错,细胞,局部谷物亚边界旋转和大角度晶粒重组的形成过程。显着不均匀的硬度分布与Ecsee诱导的样品中的变形行为和微观结构细化一致。随着ECSEE通过的增加,微观结构和硬度的均匀性提高。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号