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The Influence of A Cross-Channel Extrusion Process on The Microstructure and Properties of Copper

机译:跨通道挤压工艺对铜组织和性能的影响

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摘要

A new cross-channel extrusion (CCE) method with the application of a back pressure (BP) is proposed and experimentally tested. The introduction of pressure blocks the free flow of material by using an additional set of pistons, which prevents the loss of consistency. The paper presents results of experimental trials of CCE process. Between one and eight passes of CCE with and without a BP were applied to pure copper billets to refine their initial coarse-grained microstructure at room temperature. It was found that processing by CCE results in the formation of a lamellar structure along the extruded axis and the fine-grained structure in the remaining volume. The material exhibited dynamic recrystallization, which results in the formation of 0.5- to 2-μm grains after one pass and 2- to 8-μm grains after four CCE passes. The fine-grained material had YS of 390-415 MPa. An increase in the microhardness from 70 to 130 HV02 after one pass and then a decrease after four passes were observed. This might indicate that secondary recrystallization and selective grain growth occur, because an exothermic peak (158.5 °C, 53 ± 2.1 J/mol) was observed during DSC (differential scanning calorimetry) testing. The resistivity of the once deformed copper significantly decreases, while its further processing causes the resistivity to increase.
机译:提出并应用背压(BP)的新的跨通道挤出(CCE)方法。压力的引入通过使用另一组活塞来阻止材料的自由流动,从而防止了一致性的损失。本文介绍了CCE工艺的实验试验结果。在有和没有BP的情况下,对CCE进行1到8次通过,将其用于纯铜坯料,以在室温下细化其初始的粗晶粒组织。发现通过CCE加工导致沿挤出轴形成层状结构并且在剩余体积中形成细粒结构。该材料表现出动态再结晶,导致一次通过后形成0.5至2μm的晶粒,而经过4次CCE通过后形成2至8μm的晶粒。细粒材料的YS为390-415MPa。一次通过后,显微硬度从70 HV02增加到130 HV02,然后在四次通过后降低。这可能表明发生了二次重结晶和选择性晶粒生长,因为在DSC(差示扫描量热)测试中观察到放热峰(158.5°C,53±2.1 J / mol)。曾经变形的铜的电阻率显着降低,而对其进行进一步处理会导致电阻率增加。

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