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Analytical modeling and sensitivity analysis of the temperature distribution in the planar scanning induction heating based on 2D moving heat source

机译:基于2D移动热源的平面扫描感应加热温度分布的分析模型及敏感性分析

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This paper presents an analytical modeling method of the temperature evolution in the planar scanning induction heating, which can be applied into various heat treatment processes. Due to the uneven distribution and hard control of the electromagnetic fields in the planar induction coils, it is difficult to achieve the precisely prediction and control of the temperature evolution. In view of the low computational efficiency and the complexity in the establishment of the general finite element numerical simulation models, in this work, analytical models of this planar scanning induction heating enhanced by the magnetic flux concentrator are established by using the moving points and line heat source. The magnetic field and the eddy power density in the workpiece generated by the induction coils are calculated by Maxwell equations and then can be applied into the analytical model of the temperature evolution using the moving points and line heat source. Several sets of the corresponding finite element simulation tests and experimental tests are conducted to validate the analytical calculation results. In addition, sensitivity analysis of the main factors influencing the temperature evolution is conducted. By comparison, it is investigated that the final temperature in the surface of the heat workpiece by the analytical model in this work has a good match with the finite element simulation and the experimental results and the errors are reasonable and acceptable considering the inevitable factors. It is also obviously that the computing time of the analytical model is much less than the finite element simulation model. Thus, it is believed that the analytical model established in this paper can be used to predict the temperature evolution in the planar scanning induction heating and extends this heating method to a broader application, which has less computational time and experimental complexity.
机译:本文介绍了平面扫描感应加热中的温度演化的分析建模方法,可以应用于各种热处理过程中。由于平面感应线圈中的电磁场的分布和硬控制不均匀,难以实现温度进化的精确预测和控制。鉴于计算效率低,在建立一般有限元数值模拟模型中,在这项工作中,通过使用移动点和线路加热来建立由磁通量集中器增强的该平面扫描感应加热的分析模型来源。由感应线圈产生的工件中的磁场和涡电功率密度通过麦克斯韦方程计算,然后可以应用于使用移动点和线热源的温度演进的分析模型。进行几组相应的有限元模拟测试和实验测试以验证分析计算结果。此外,进行了影响温度进化的主要因素的敏感性分析。相比之下,通过该工作中的分析模型研究热工件表面中的最终温度与有限元模拟的良好匹配和实验结果,考虑不可避免的因素,误差是合理的,并且可以接受。显然,分析模型的计算时间远小于有限元模拟模型。因此,据信,在本文中建立的分析模型可用于预测平面扫描感应加热中的温度演变,并将这种加热方法延伸到更广泛的应用,其具有较少的计算时间和实验复杂性。

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