首页> 外文期刊>ZAMP: Zeitschrift fur Angewandte Mathematik und Physik: = Journal of Applied Mathematics and Physics: = Journal de Mathematiques et de Physique Appliquees >An analytical analysis of receding contact between a compressible elastic thin film and a rigid substrate due to spherical indentation
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An analytical analysis of receding contact between a compressible elastic thin film and a rigid substrate due to spherical indentation

机译:由球形压痕引起的可压缩弹性薄膜和刚性基板之间的后退接触的分析分析

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摘要

A simple analytical method based on the Kerr-type model is proposed to study the spherical indentation of a compressible elastic thin film resting on a rigid flat substrate. The interface between the film and the substrate is either frictionless or infinitely rough. Due to indentation, the outer part of the film's lower surface loses contact with the substrate, and the contact zone along the film-substrate interface shrinks to a circular area. The radius of the contact zone is then derived and several asymptotic explicit relations between the indentation force, the indentation depth and the indentation radius are obtained, with the aid of an energy method. The present analytical method is remarkably simpler than existing numerical methods. Reasonable agreement with finite element analysis results shows that the present method has the capability to capture the main contact behaviors of a compressible elastic thin film resting on a rigid substrate.
机译:提出了一种基于KERR型模型的简单分析方法,研究了搁置在刚性扁平基板上的可压缩弹性薄膜的球形压痕。 薄膜和基板之间的界面是无摩擦或无限粗糙的。 由于压痕,薄膜的下表面的外部与基板失去接触,并且沿着薄膜基板界面的接触区收缩到圆形区域。 然后导出接触区域的半径,并且借助于能量法获得压痕力,压痕深度和压痕半径之间的几个渐近显式关系。 本分析方法比现有的数值方法更简单。 合理的协议与有限元分析结果表明,本方法具有捕获在刚性基板上捕获可压缩弹性薄膜的主要接触行为的能力。

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