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首页> 外文期刊>Journal of Applied Mechanics: Transactions of the ASME >A Mechanism-Based Four-Chain Constitutive Model for Enthalpy-Driven Thermoset Shape Memory Polymers With Finite Deformation
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A Mechanism-Based Four-Chain Constitutive Model for Enthalpy-Driven Thermoset Shape Memory Polymers With Finite Deformation

机译:一种基于机制的四链组成型模型,用于具有有限变形的焓驱动热固性塑料形状记忆聚合物

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Chemically cross-linked thermoset shape memory polymers (TSMPs) are an important branch of smart materials due to their potentially wide applications in deplorable structures, soft robots, damage self-healing, and 4D printing. Further development and design of TSMP structures call for constitutive models. Although the Arruda–Boyce eight-chain model has been very successful and widely used for entropy-driven TSMPs, recent studies found that some new TSMPs, such as those using enthalpy as the primary driving force, show unit cells different from the eight-chain model. Considering that these new epoxy-based TSMP networks consist of a plenty of four-chain features, this study proposes a four-chain tetrahedron structure as the unit cell of the network to construct the constitutive model. In this model, Gibbs free energy is used to formulate the thermodynamic driving force. Then, by introducing a transition of the molecule deformation mechanism from that dominated by bond stretch to that dominated by bond angle opening, the traditional Langevin chain model is modified. It is found that this model can well capture the dramatic modulus change for the new TSMP in the thermomechanical experiments. Moreover, it shows that the original Treloar four-chain model and Arruda–Boyce eight-chain model underestimate the driving force for the enthalpy-driven TSMPs, and thus cannot well capture the thermomechanical behaviors. It is also found that under certain conditions, our four-chain model produces the same Cauchy stress as the eight-chain model does. This study may help researchers understand the thermomechanical response and design a special category of TSMPs with high recovery stress.
机译:化学交联的热固性形状记忆聚合物(TSMPS)是智能材料的重要分支,因为它们在可令人难忘的结构,软机器人,损坏自愈和4D印刷中的潜在广泛的应用。 TSMP结构的进一步开发和设计呼叫本构模型。虽然Aruda-Boyce八链模型一直非常成功并广泛用于熵驱动的TSMP,但最近的研究发现,一些新的TSMP,例如使用焓作为主要驱动力的TSMP,显示单位细胞与八链不同模型。考虑到这些基于新的环氧基的TSMP网络由大量的四链特征组成,本研究提出了一种四链四面体结构作为网络的单元单元来构建本构模型。在该模型中,Gibbs自由能量用于制定热力学驱动力。然后,通过将分子变形机制的转变从由键伸部伸架到由键角开口支配的粘合,传统的Langevin链模型被修改。结果发现,该模型可以很好地捕获热机械实验中新TSMP的戏剧模量变化。此外,它表明,原始的三罗拉四链模型和Aruda-Boyce八链模型低估了焓驱动的TSMP的驱动力,因此无法捕获热机械行为。还发现,在某些条件下,我们的四链模型会产生相同的Cauchy压力,因为八个链模型确实如此。本研究可以帮助研究人员了解热机械响应和设计具有高回收压力的特殊类型的TSMP。

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