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A Study on the Interface Microstructure of Diffusion Bonded AISI410/SU718 Dissimilar Joints

机译:扩散粘接AISI410 / SU718不同关节界面微观结构的研究

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Solid state diffusion bonding (DB) between Inconel 718 and 410 Martensitic stainless steels were done by changing bonding temperature from 900 to 1000°C in steps of 50°C with a consistent pressure of 16 MPa and holding time of 60 minutes. Optical microscopy and scanning electron microscopy (SEM) were utilized to inspect the pain growth and the chemical species of the inter- face structure. The thickness of reaction layer in interfaces was enhanced with growing bonding temperature. Room-temperature properties of the bonded joints were characterized using micro hardness evaluation.
机译:通过在50℃的步骤为50℃的步骤中,通过将粘合温度从900至1000℃改变为16MPa的一致压力并保持60分钟的时间来完成Inconel 718和410马氏体不锈钢之间的固态扩散键合(DB)。 光学显微镜和扫描电子显微镜(SEM)用于检查疼痛生长和面部间结构的化学物质。 粘合温度增长温度增长,界面中反应层的厚度增强。 使用微硬度评估表征粘合接头的室温性质。

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