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Microstructure and properties of graphite nanoflakes/Cu matrix composites fabricated by pressureless sintering and subsequent thermo-mechanical treatment

机译:无压烧结制造的石墨纳米薄片/ Cu基质复合材料的微观结构和性能及随后的热机械处理

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摘要

A self-developed pressureless sintering and subsequent thermo-mechanical treatment process was employed to fabricate 1-5 wt% graphite nanoflakes (GNFs)/Cu matrix composites. The distribution of GNFs and GNFs/Cu interface structure, as well as mechanical and thermal properties of the composites were investigated. The results showed that the thermo-mechanical treatment can significantly improve the GNFs/Cu interface structure, as well as the densities and properties of the composites. However, the distribution orientation of the GNFs and the anisotropy of properties of the composites increase in the process. After pressureless sintering and thermo-mechanical treatment, the relative densities of the 1-5 wt% GNFs/Cu matrix composites can rise as high as 99.4%. As the amount of the GNFs is increased from 1 wt% to 5 wt%, the thermal conductivities of the composites change from 380.4 W/(m.K) to 244.4 W/(m.K) in rolling direction and from 179.3 W/(m.K) to 51.9 W/(m.K) in normal direction. The tensile strengths and the coefficients of thermal expansion of the composites change form 153 MPa to 56 MPa and from 13.5 x 10(-6)/K to 11.9 x 10(-6)/K respectively. This fully satisfies the application requirements of electronic packaging materials.
机译:采用自我开发的无压烧结和随后的热机械处理工艺制造1-5wt%石墨纳米薄膜(GNFS)/ Cu基复合材料。研究了GNF和GNFS / Cu接口结构的分布,以及复合材料的机械和热性质。结果表明,热机械处理可以显着改善GNF / Cu接口结构,以及复合材料的密度和性质。然而,GNFS的分布取向和复合材料的性质的各向异性增加了该过程。无压烧结和热机械处理后,1-5wt%GNFS / Cu基质复合材料的相对密度可以高达99.4%。随着GNFS的量从1wt%增加到5wt%,复合材料的热导率从380.4 w /(mk)变为244.4 w /(mk),滚动方向和179.3 w /(mk)。正常方向51.9 w /(mk)。复合材料的拉伸强度和热膨胀系数将形成153MPa至56MPa和13.5×10(-6)/ k至11.9×10(-6)/ k分别改变。这完全满足了电子包装材料的应用要求。

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