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首页> 外文期刊>Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology >Microstructural, chemical and electrical characteristics of Au/magnetite (Fe3O4)/n-GaN MIS junction with a magnetite interlayer
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Microstructural, chemical and electrical characteristics of Au/magnetite (Fe3O4)/n-GaN MIS junction with a magnetite interlayer

机译:AU /磁铁矿(FE3O4)/ N-GaN MIS结用磁铁矿中间层的微观结构,化学和电气特性

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Magnetite (Fe3O4) layers were prepared on n-type GaN surface by the e-beam method and its microstructural and compositional characteristics were evaluated by XRD, XPS and TEM techniques. The XRD, XPS and TEM evaluations confirmed the formation of the Fe3O4 layer on the n-GaN surface. Then, the Au/Fe3O4/n-GaN metal/interlayer/semiconductor (MIS) junction was fabricated and its electrical properties investigated with the I-V and C-V approaches. The MIS junction showed a good rectification nature with a high barrier height (0.83 eV) compared to the SE (0.71 eV). This implies that the barrier height was markedly affected by the Fe3O4 layer. Further, the barrier height was extracted by means of Cheung's, Norde and psi(s)-V plot and it was found that the values are nearly matched with one another, indicating that the methods used were consistent and valid. The frequency-dependent properties of the MIS and SE junctions have also been discussed. The interface state density (N-ss) of the MIS junction was found to be lower than the SE, indicating that the Fe3O4 layer plays a vital role in the decreased N-ss. Based on the analysis, it can be concluded that the Fe3O4 layer is an apt material for the fabrication of new electronic device applications.
机译:通过电子束法在n型GaN表面上制备磁铁矿(Fe3O4)层,通过XRD,XPS和TEM技术评估其微观结构和组成特性。 XRD,XPS和TEM评估证实了在N-GaN表面上形成Fe3O4层。然后,制造Au / Fe3O4 / n-GaN金属/层间/半导体(MIS)结,并用I-V和C-V方法研究其电性能。与SE(0.71eV)相比,MIS结显示出具有高阻挡高度(0.83eV)的良好整流性质。这意味着屏障高度明显受到Fe3O4层的影响。此外,通过Cheung的,Norde和PSI(S)-V图提取了阻挡层高度,发现该值与彼此匹配,表明所用方法一致且有效。还讨论了MIS和SE结的频率依赖性属性。发现MIS结的界面状态密度(N-SS)低于SE,表明FE3O4层在降低的N-SS中起着至关重要的作用。基于分析,可以得出结论,Fe3O4层是制造新的电子设备应用的APT材料。

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