Mordica Lecture: methods of optimizing wire-die alignment

摘要

This presentation proposes a bold way for the wire drawing industry to rethink a traditional practice. It discusses key non-geometrical concepts concerning die alignment - along with the need for reducing wire oscillations - as inexpensive methods for improving finished wire properties, reducing wire breaks and reducing die wear. Key specific report points: Editor's note. As this presentation about Wire Properties Alignment (WPA) presents a number of evocative concepts about wire-die alignment over 13 pages, the below key points have been identified with the corresponding pages.