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机译:通过无电镀改善Ni / Au涂层在电路上的均匀性
Hefei Univ Technol Inst Ind &
Equipment Technol Hefei 230009 Anhui Peoples R China;
Hefei Normal Univ Dept Chem &
Chem Engn Hefei Anhui Peoples R China;
Hefei Univ Technol Sch Mat Sci &
Engn Hefei Anhui Peoples R China;
Hefei Univ Technol Inst Ind &
Equipment Technol Hefei 230009 Anhui Peoples R China;
Patterned circuit; electroless gold plating; fine pitch; surface;
机译:通过无电镀改善Ni / Au涂层在电路上的均匀性
机译:通过化学镀处理在亚麻织物上改善耐蚀性的Cu-Ni-Gd涂层以屏蔽电磁干扰
机译:预测和补充还原剂以提高化学镀Ni-P镀层的效率和磨损行为
机译:用于有机包装基体上金线焊接的化学镀镍/电镀钯/浸入金/电镀金
机译:电解密码沉积制造的Ni-Craly和Ni / Co-Craly涂料的表征
机译:镁合金上化学镀Ni-P-Al2O3复合镀层的沉积工艺及性能
机译:无电镀Ni / Pd / Au电镀焊球关节可靠性研究 - 化学镀PD电镀膜厚度影响 -