首页> 外文期刊>Transactions of the Indian Institute of Metals >Dislocation Interaction and V-Shaped Growth of the Distorted Structure During Nanoindentation of Cu20Ni20Al20Co20Fe20 (high-entropy alloy)-Coated Copper: A Molecular Dynamics Simulation-Based Study
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Dislocation Interaction and V-Shaped Growth of the Distorted Structure During Nanoindentation of Cu20Ni20Al20Co20Fe20 (high-entropy alloy)-Coated Copper: A Molecular Dynamics Simulation-Based Study

机译:Cu20Ni20CO20CO202020202020(高熵合金)涂覆铜的纳米狭窄期间畸变相互作用和V形生长的扭曲结构钝化铜:基于分子动力学模拟的研究

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摘要

In this paper, the deformation behavior of Cu20Ni20Al20Co20Fe20 high-entropy alloy-coated single-crystal Cu substrate which undergoes nanoindentation has been investigated under molecular dynamic simulation with embedded-atom method potential. The dynamic structural evolutions under nanoindentation are presented using centrosymmetry parameter analysis, common neighbor analysis and radial distribution function plots. In the initial level of nanoindentation, the interface deformation is greatly confronted by the confined V-shaped growth of the distorted structure. But the sudden discrete dislocation burst account for avalanche break-down in the interface layer, which further get influenced by the evolution of multiple dislocation nodes that is significantly governed by core spreading, extended misfit dislocation generation and relative rotation. In the meanwhile, the subsequent generation of dislocation locks, complicated multiple dislocation loops, dislocation junctions and limited cross-slip in wide stacking faults (SFs) hasten the work hardening and in turn slows down the deformation progress. On the other hand, the intermediate appearance of narrow SFs and slip bands significantly reduces the work hardening rate that increases the optimum fracture strain value of the specimen. Moreover, the overall increase in dislocation density and dislocation length leads to a significant growth in dislocation sources which leads to forest hardening in the later stage.
机译:本文采用嵌入式原子方法施加的分子动态模拟研究了Cu20Ni20Al20CO20Fe2020Fe2020Fe20的高熵合合金涂覆的单晶Cu衬底的变形行为。使用CentroSymmetry参数分析,公共邻分析和径向分布函数图呈列纳米indentation下的动态结构演变。在纳米温度的初始水平中,界面变形大大面对扭曲结构的狭窄的V形生长。但是,界面层中雪崩分解的突然离散位错突发账户,这进一步受到核心扩散的多个脱位节点的演变的影响,这是核心扩展的延长的错入脱位生成和相对旋转。同时,随后的脱位锁,复杂的多次脱位环,位错结和宽堆叠故障(SFS)的有限交叉滑动,加速了硬化,又减缓了变形进展。另一方面,窄SF和滑动带的中间外观显着降低了增加样本的最佳断裂应变值的工作化硬化速率。此外,位错密度和位错长度的总体增加导致错位源的显着增长,这导致了后期的森林硬化。

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